The next generation of optical module packaging technology
Transimpedance Amplifier
Powering the markets fastest cloud AI and carrier networks
Laser Driver
Empowering high speed optical connectivity for AI applications
Electrical PAM-X DSP
Pushing the boundaries of copper connectivity
Optical PAM-X DSP
Delivering high bandwidth over distance
LPO Transceiver
The next generation of optical module packaging technology
Transimpedance Amplifier
Powering the markets fastest cloud AI and carrier networks
Laser Driver
Empowering high speed optical connectivity for AI applications
Electrical PAM-X DSP
Pushing the boundaries of copper connectivity
Optical PAM-X DSP
Delivering high bandwidth over distance
LPO Transceiver
The next generation of optical module packaging technology
Transimpedance Amplifier
Powering the markets fastest cloud AI and carrier networks
Laser Driver
Empowering high speed optical connectivity for AI applications
Markets
Active Electrical Cable (AEC)
1-VIA's industry-leading AEC chips for enhanced signal integrity over long copper distances. Learn more about 1-VIA's market disrupting electrical PAM-X DSP technology.
Our range of industry-leading AOC chips designed to enable next generation connectivity at ultra-high-speed and ultra-low-power for data centers all over the world. Learn more about 1-VIA's market disrupting optical PAM-X DSP technology.
Discover how 1-VIA's high-speed, ultra-low-power data converter solutions offering industry-leading performance can help you meet your 5G fronthaul needs.
Discover how 1-VIA's high-speed, ultra-low-power data converter solutions offering industry-leading performance can help you meet your 5G backhaul needs.
Learn more about what you can achieve for your fronthaul, midhaul and backhaul needs with 1-VIA's industry-leading PAM-X DSP technology providing the world’s highest bandwidth at ultra-low-power.
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